项目主要建设内容为搭建0.1-2mm厚度的超薄浮法电子玻璃生产线，生产可应用于电子，微电子，光电子领域的一类高技术产品，主要用于制作集成电路以及具有光电，热电，声光，磁光等功能元器件的玻璃材料。
The project plans to construct an ultra-thin float electronic glass production line producingglass with thickness ranging from
0.1 mm to2 mm.This type of glass is a hightech product for applications in electronics, microelectronics, andoptoelectronics primarily for the fabrication of integrated circuits and functional components with photo- electric,thermoelectric,acoustooptic,and magnetooptic properties.
